Plated copper is more conductive than sputter-deposited aluminum which leads to less hat and smaller ICs but copper is more expensive than aluminum. If you could electroplate aluminum from a ionic liquid solution in a structure like figure 2, then can you have a better IC? Than with an IC using Sputter-deposited aluminum formed by the process shown in figure 1? Why?
This question belongs to physics and discusses about integrated circuits of patterning of copper by damascene plating.
Total word count: 115
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