Plated copper is more conductive than sputter-deposited aluminum which leads to less hat and smaller ICs but copper is more expensive than aluminum. If you could electroplate aluminum from a ionic liquid solution in a structure like figure 2, then can you have a better IC? Than with an IC using Sputter-deposited aluminum formed by the process shown in figure 1? Why?
- Yes, plated aluminum is denser and has higher conductivity than sputter-deposited Al.
- No, because denser plated aluminum is the same as low density sputter-deposited Al, so it is not worth extra trouble.
- Nobody knows, because no one has ever made IC with electroplated Al.
- a and b
- a and c
- Nobody cares
This question belongs to physics and discusses about integrated circuits of patterning of copper by damascene plating.
Total word count: 115
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