Formation of Sputter-deposited Aluminum


Plated copper is more conductive than sputter-deposited aluminum which leads to less hat and smaller ICs but copper is more expensive than aluminum. If you could electroplate aluminum from a ionic liquid solution in a structure like figure 2, then can you have a better IC? Than with an IC using Sputter-deposited aluminum formed by the process shown in figure 1? Why?


  1. Yes, plated aluminum is denser and has higher conductivity than sputter-deposited Al.
  2. No, because denser plated aluminum is the same as low density sputter-deposited Al, so it is not worth extra trouble.
  3. Nobody knows, because no one has ever made IC with electroplated Al.
  4. a and b
  5. a and c
  6. Nobody cares


This question belongs to physics and discusses about integrated circuits of patterning of copper by damascene plating.

Total word count: 115


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